Seiko epson corporation (20250002713). Molding Material
Molding Material
Organization Name
Inventor(s)
Tomohiro Fujita of Matsumoto JP
Molding Material
This abstract first appeared for US patent application 20250002713 titled 'Molding Material
Original Abstract Submitted
a molding material according to one embodiment of the present disclosure is a molding material containing cellulose fibers and a resin, and the resin includes a saturated aliphatic polyester and a highly polar polyester. in a molecular weight distribution curve by a gpc method, the resin has a maximum value 2 at a weight average molecular weight of 100,000 or more and a maximum value 1 at a weight average molecular weight less than that at the maximum value 2, and an area value in the maximum value 2 is smaller than an area value in the maximum value 1.