Seiko epson corporation (20250002686). Material For Molding
Material For Molding
Organization Name
Inventor(s)
Tomohiro Fujita of Matsumoto JP
Material For Molding
This abstract first appeared for US patent application 20250002686 titled 'Material For Molding
Original Abstract Submitted
a material for molding according to an embodiment of the present disclosure is a material for molding containing cellulose fibers and a resin. the resin contains a binder and urethane fibers. the resin has a maximum 1 at a weight average molecular weight of 50,000 to 150,000 and a maximum 2 at a weight average molecular weight of 75,000 to 300,000 in a molecular weight distribution curve by a gpc method with chloroform as an eluate. an area value at the maximum 2 is smaller than an area value at the maximum 1.