Resonator Device

Organization Name

seiko epson corporation

Inventor(s)

Junichi Takeuchi of Chino (JP)

Tomoyuki Kamakura of Matsumoto (JP)

Ryuta Nishizawa of Nagano (JP)

Yukihiro Hashi of Shiojiri (JP)

Resonator Device - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240283425 titled 'Resonator Device

The abstract describes a resonator device comprising a base, a resonator element with a resonator substrate and an electrode, a conductive layer on the base, a metal bump between the conductive layer and the resonator element, and low elastic modulus layers between the base and the conductive layer, and the resonator substrate and the electrode.

The resonator device includes a base, resonator element, conductive layer, metal bump, and low elastic modulus layers.
The metal bump electrically couples the conductive layer and the electrode while bonding them together.
The low elastic modulus layers have a smaller elastic modulus than the metal bump.
The low elastic modulus layers overlap the metal bump in a plan view of the base.
The resonator element is effectively connected to the base through the metal bump and low elastic modulus layers.

Potential Applications: - This technology can be used in various electronic devices requiring resonator elements. - It can be applied in communication systems, sensors, and other devices where resonators are essential.

Problems Solved: - Provides a reliable and efficient way to connect the resonator element to the base. - Ensures proper electrical coupling between the electrode and the conductive layer.

Benefits: - Improved performance and stability of resonator devices. - Enhanced durability and longevity of electronic components.

Commercial Applications: Title: Advanced Resonator Devices for Electronic Applications This technology can be utilized in the telecommunications industry for signal processing and filtering applications. It can also find applications in the automotive sector for sensors and control systems.

Prior Art: Prior research in the field of resonator devices may include studies on different bonding techniques and materials used for connecting resonator elements to bases.

Frequently Updated Research: Researchers are constantly exploring new materials and methods to enhance the performance of resonator devices. Stay updated on the latest advancements in resonator technology for potential improvements in electronic applications.

Questions about Resonator Devices: 1. How does the low elastic modulus layer contribute to the overall performance of the resonator device?

  - The low elastic modulus layer helps to reduce stress and strain on the device, ensuring better stability and reliability.

2. What are the key factors to consider when designing resonator devices for specific applications?

  - Factors such as frequency range, size constraints, and environmental conditions play a crucial role in the design of resonator devices.

Original Abstract Submitted

a resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.