Samsung sdi co., ltd. (20250144695). ELECTRODE PLATE PROCESSING APPARATUS AND METHOD
ELECTRODE PLATE PROCESSING APPARATUS AND METHOD
Organization Name
Inventor(s)
Yongseung Shin of Yongin-si KR
ELECTRODE PLATE PROCESSING APPARATUS AND METHOD
This abstract first appeared for US patent application 20250144695 titled 'ELECTRODE PLATE PROCESSING APPARATUS AND METHOD
Original Abstract Submitted
an electrode plate processing apparatus includes: a punch configured to cut an electrode plate; a die configured to seat the electrode plate thereon and accommodating the punch; a pressure measurement member on at least one of the punch or the die, and configured to measure a pressure applied to the punch or the die in a process in which the punch is lowered; a clearance adjustment unit on the die, and configured to adjust a clearance between the punch and the die by pressing the punch; and a control unit configured to control an operation of the clearance adjustment unit based on the pressure measured by the pressure measurement member.