Samsung electronics co., ltd. (20250149519). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250149519 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a package substrate, a plurality of stacked structures on the package substrate, each stacked structure including a plurality of core chips stacked on each other, each core chip including a memory cell array including a plurality of memory cells, a buffer chip on the package substrate, and spaced apart from the plurality of stacked structures in a horizontal direction, and a photonics package including an optical integrated circuit chip on the package substrate, an electronic integrated circuit chip on the optical integrated circuit chip, and a first molding layer surrounding side surfaces of the electronic integrated circuit chip, wherein the buffer chip is configured to control the memory cell of the core chip of each of the plurality of stacked structures.