Samsung electronics co., ltd. (20250149515). SEMICONDUCTOR PACKAGES
SEMICONDUCTOR PACKAGES
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SEMICONDUCTOR PACKAGES
This abstract first appeared for US patent application 20250149515 titled 'SEMICONDUCTOR PACKAGES
Original Abstract Submitted
a semiconductor package, comprising: a semiconductor chip; a conductive bonding layer on the semiconductor chip; an upper insulating layer on the conductive bonding layer; an upper package on the upper insulating layer; a heat dissipation structure that includes upper heat dissipation patterns and upper heat dissipation vias, wherein the upper heat dissipation patterns are in the upper insulating layer, and the upper heat dissipation vias connect the conductive bonding layer and the upper heat dissipation patterns; and a heat dissipation member on at least one side of the upper package, wherein the heat dissipation member is connected to the upper heat dissipation patterns.