Samsung electronics co., ltd. (20250149494). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
This abstract first appeared for US patent application 20250149494 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Original Abstract Submitted
a semiconductor package includes a first substrate, a first semiconductor chip on an upper surface of the first substrate, a first bump between the first substrate and the first semiconductor chip, a first underfill layer that fills a center portion of a space between the first substrate and the first semiconductor chip, and a first molding member that covers an upper surface and side surfaces of the first semiconductor chip, and fills a periphery portion of the space between the first substrate and the first semiconductor chip, wherein a volume occupied by the first molding member in the space between the first substrate and the first semiconductor chip is greater than a volume occupied by the first underfill layer in the space between the first substrate and the first semiconductor chip.