Samsung electronics co., ltd. (20250149479). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250149479 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor chip includes: a substrate; a plurality of upper pads on the substrate, the plurality of upper pads including a first group of the upper pads and a second group of the upper pads; a buffer layer covering a side surface of the first group of the upper pads; and an insulating layer surrounding a side surface of the second group of the upper pads and a side surface of the buffer layer on the substrate, wherein the buffer layer includes a first material having a first young's modulus smaller than a second young's modulus of a second material in the plurality of upper pads.