Samsung electronics co., ltd. (20250149476). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
This abstract first appeared for US patent application 20250149476 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Original Abstract Submitted
a semiconductor chip includes a semiconductor substrate having a first surface and a second surface opposite to the first surface. an active layer is disposed in a portion of the semiconductor substrate adjacent to the first surface. a through electrode extends in the semiconductor substrate in a vertical direction. the through electrode has a lower surface connected to the active layer and an upper surface positioned at a level lower than a level of the second surface of the semiconductor substrate. a passivation layer is disposed on the second surface of the semiconductor substrate. a bonding pad is arranged on a portion of the passivation layer and the upper surface of the through electrode. the bonding pad has a cross-section with a “t” shape in the vertical direction. the bonding pad is connected to the through electrode.