Samsung electronics co., ltd. (20250147409). METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 20250147409 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Original Abstract Submitted
a method for manufacturing a semiconductor device includes providing a first pre-reticle including a first overlay mark and a first on-cell pattern. a second pre-reticle is provided that includes a second overlay mark and a second on-cell pattern. a first pattern is formed from the first pre-reticle using a first illumination system. a second pattern is formed from the second pre-reticle using a second illumination system. an overlay error is measured between the first pattern and the second pattern. a corrected reticle is formed based on the measured overlay error.