Samsung electronics co., ltd. (20250146553). DAMPING APPARATUS AND GRINDER INCLUDING THE SAME
DAMPING APPARATUS AND GRINDER INCLUDING THE SAME
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DAMPING APPARATUS AND GRINDER INCLUDING THE SAME
This abstract first appeared for US patent application 20250146553 titled 'DAMPING APPARATUS AND GRINDER INCLUDING THE SAME
Original Abstract Submitted
a damping apparatus may include a plurality of weights, a plurality of dampers, a plurality of springs and a plurality of pressurizing modules. the plurality of the weights may be connected to a spindle. the plurality of the dampers may be arranged between adjacent lower weights among the plurality of the weights to attenuate a vibration of the spindle. the plurality of the springs may be arranged between adjacent upper weights among the plurality of the weights. the plurality of the pressurizing modules may be configured to selectively connect each of the springs with adjacent upper weights. thus, a natural frequency of the damping apparatus may be controlled to effectively attenuate the vibration of the spindle.