Samsung electronics co., ltd. (20250135601). WAFER GRINDING METHOD
WAFER GRINDING METHOD
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WAFER GRINDING METHOD
This abstract first appeared for US patent application 20250135601 titled 'WAFER GRINDING METHOD
Original Abstract Submitted
a wafer grinding method includes loading a wafer onto a first chuck, first lowering a spindle having a wheel from a first vertical position to a second vertical position, second lowering the spindle from the second vertical position to a third vertical position, grinding the wafer by the wheel, identifying the third vertical position of the spindle by determining whether amounts of change in an operation current of the spindle exceed a reference amount of change in current, calculating spindle feedback displacement, and applying the spindle feedback displacement to the second vertical position of the first chuck.