Samsung electronics co., ltd. (20250132228). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
This abstract first appeared for US patent application 20250132228 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
Original Abstract Submitted
a semiconductor chip and a semiconductor package are provided. the semiconductor chip includes a substrate, a first interlayer insulating layer, a porous insulating layer, and a second interlayer insulating layer stacked on the substrate, lower pads on the second interlayer insulating layer and having a first thickness in a vertical direction, third and fourth interlayer insulating layers stacked on the lower pads and the second interlayer insulating layer, an upper pad on the fourth interlayer insulating layer and having a second thickness in the vertical direction greater than the first thickness, and via structures in the fourth interlayer insulating layer and the third interlayer insulating layer and electrically connecting the lower pads and the upper pad. each of the via structures includes a first via in the third interlayer insulating layer and a second via in the fourth interlayer insulating layer and overlapping the first via in the vertical direction.