Samsung electronics co., ltd. (20250132226). SEMICONDUCTOR DEVICE WITH POROUS CAPILLARY STRUCTURE
SEMICONDUCTOR DEVICE WITH POROUS CAPILLARY STRUCTURE
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SEMICONDUCTOR DEVICE WITH POROUS CAPILLARY STRUCTURE
This abstract first appeared for US patent application 20250132226 titled 'SEMICONDUCTOR DEVICE WITH POROUS CAPILLARY STRUCTURE
Original Abstract Submitted
a semiconductor device includes a semiconductor chip including a heat transfer surface and a semiconductor integrated circuit, a plurality of porous microstructures each including a plurality of internal pores, external capillary channels between the plurality of porous microstructures, and internal capillary channels in the plurality of porous microstructures, where each of the plurality of porous microstructures are configured to generate a capillary force causing a flow of coolant that exchanges heat with the heat transfer surface of the semiconductor chip.