Samsung electronics co., ltd. (20250126860). INTEGRATED CIRCUIT DEVICE
INTEGRATED CIRCUIT DEVICE
Organization Name
Inventor(s)
Hidenobu Fukutome of Suwon-si KR
INTEGRATED CIRCUIT DEVICE
This abstract first appeared for US patent application 20250126860 titled 'INTEGRATED CIRCUIT DEVICE
Original Abstract Submitted
an integrated circuit device includes: a substrate including a first surface and a second surface; a fin-type active area extending on the first surface of the substrate in a first horizontal direction, and including a first area and a second area that are adjacent to each other; a first source/drain area arranged on the first area of the fin-type active area; a second source/drain area arranged on the second area of the fin-type active area; and a first filling insulating layer extending between the first source/drain area and the second source/drain area, wherein the first area includes a first conductivity type, wherein the second area includes a second conductivity type that is different from the first conductivity type, and wherein a boundary between the first area and the second area includes a portion that is substantially perpendicular to the first horizontal direction, and overlaps the filling insulating layer.