Samsung electronics co., ltd. (20250126778). INTEGRATED CIRCUIT DEVICE
INTEGRATED CIRCUIT DEVICE
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INTEGRATED CIRCUIT DEVICE
This abstract first appeared for US patent application 20250126778 titled 'INTEGRATED CIRCUIT DEVICE
Original Abstract Submitted
an integrated circuit device and a method of manufacturing the same are provided. the integrated circuit device includes: a substrate having a plurality of active regions; a bit line extending on the substrate in a horizontal direction parallel to an upper surface of the substrate; a direct contact electrically connected to a first active region of the plurality of active regions and connected to the bit line; a contact plug electrically connected to a second active region of the plurality of active regions adjacent to the first active region; and an outer insulation spacer between the bit line and the contact plug and overlapping the bit line in a vertical direction perpendicular to the upper surface of the substrate. the outer insulation spacer includes a doped region doped with a metal element.