Samsung electronics co., ltd. (20250125221). SEMICONDUCTOR DEVICE HAVING HOLLOW CAPILLARY STRUCTURE
SEMICONDUCTOR DEVICE HAVING HOLLOW CAPILLARY STRUCTURE
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SEMICONDUCTOR DEVICE HAVING HOLLOW CAPILLARY STRUCTURE
This abstract first appeared for US patent application 20250125221 titled 'SEMICONDUCTOR DEVICE HAVING HOLLOW CAPILLARY STRUCTURE
Original Abstract Submitted
a semiconductor device includes: a semiconductor chip including a semiconductor integrated circuit; a heat transfer member covering an upper surface of the semiconductor chip; and a plurality of microstructures on an upper surface of the heat transfer member and configured to generate a capillary force to cause a flow of a coolant, wherein a first capillary channel is provided between adjacent microstructures of the plurality of microstructures, and at least one of the plurality of microstructures may include a hollow microstructure in which a second capillary channel is provided.