SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250118651 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Original Abstract Submitted

a semiconductor package includes a first semiconductor chip including a semiconductor substrate having an active surface and an inactive surface, a device layer on the active surface, first chip pads on the device layer, and a first through-electrode and a second through-electrode, where the first through-electrode and the second through-electrode penetrate the semiconductor substrate, at least one of the first chip pads is connected to the first through-electrode and at least one of the first chip pads is connected to the second through-electrode, a redistribution structure including a redistribution layer on the inactive surface of the semiconductor substrate and a redistribution via connected to the redistribution layer, contact pads on an upper surface of the redistribution structure, and a second semiconductor chip on the redistribution structure and including second chip pads connected to the contact pads.