Samsung electronics co., ltd. (20250118620). SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Young-Deuk Kim of Suwon-si KR

Heejung Hwang of Suwon-si KR

SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 20250118620 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

disclosed is a semiconductor package including a wiring substrate, an external connection terminal on a bottom surface of the wiring substrate, an interposer substrate on a top surface of the wiring substrate, a first semiconductor chip on the interposer substrate, and a first chip stack on the interposer substrate and horizontally spaced apart from the first semiconductor chip. the wiring substrate includes a core, an upper redistribution layer covering a top surface of the core, and a lower redistribution layer covering a bottom surface of the core. the core includes core through vias vertically penetrating the core, and a first thermal radiation structure below the first chip stack and in the core. the first thermal radiation structure is electrically insulated from the upper and lower redistribution layers. a thermal conductivity of the first thermal radiation structure is greater than that of the core.