Samsung electronics co., ltd. (20250118574). METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Byoungwook Jang of Suwon-si KR
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
This abstract first appeared for US patent application 20250118574 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
Original Abstract Submitted
a method of manufacturing a semiconductor package includes providing a fan-out wafer on a support member, where the fan-out wafer includes a plurality of package regions and a plurality of dummy regions along an edge of the fan-out wafer, and where the plurality of package regions are divided by a cutting region, attaching the fan-out wafer to an adhesive member that is on a ring frame, forming a sealing member along the edge of the fan-out wafer and on the adhesive member to at least partially surround a plurality of dummy packages on the plurality of dummy regions, and cutting the fan-out wafer along the cutting region to separate the plurality of package regions.