Samsung electronics co., ltd. (20250105235). SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Organization Name

samsung electronics co., ltd.

Inventor(s)

JUNGHOON Kang of Suwon-si KR

SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 20250105235 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

a semiconductor package includes a first redistribution substrate, a first semiconductor chip having first pads on the first semiconductor chip, a second redistribution substrate on the first semiconductor chip, a first vertical connection structure through which the first and second redistribution substrates are electrically connected on one side of the first semiconductor chip, a second semiconductor chip on the second redistribution substrate, a first molding layer that covers the second semiconductor chip on the second redistribution substrate, a third redistribution substrate on the first molding layer; and a second vertical connection structure which is coupled to the second redistribution substrate and through which the second and third redistribution substrates are electrically connected on one side of the second semiconductor chip. a wiring pattern of the second redistribution substrate is coupled to the first pads of the first semiconductor chip.