Samsung electronics co., ltd. (20250105183). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyung Chul Shin of Suwon-si KR
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250105183 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
Original Abstract Submitted
according to example embodiments of the present inventive concept, a semiconductor chip includes: a semiconductor substrate including a first surface and a second surface that is opposite to the first surface; a through-via disposed in the semiconductor substrate; a first bonding pad disposed on the first surface of the semiconductor substrate and electrically connected to the through-via; a first dummy pad disposed on the first surface of the semiconductor substrate and insulated from the through-via; and a second bonding pad disposed on the second surface of the semiconductor substrate and electrically connected to the through-via, wherein a first maximum width of the first bonding pad is greater than a second maximum width in a first direction of the first dummy pad and is smaller than a third maximum width in a second direction of the first dummy pad, and wherein the first direction is substantially perpendicular to the second direction.