Samsung electronics co., ltd. (20250105116). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEONG-HOON Bae of Cheonan-si KR
ATSUSHI Fujisaki of Seongnam-si KR
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250105116 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package may include a redistribution substrate, a semiconductor chip mounted on a top surface of the redistribution substrate, and a conductive terminal provided on a bottom surface of the redistribution substrate. the redistribution substrate may include an under-bump pattern including a via portion in contact with the conductive terminal and a wire portion on the via portion and an insulating layer covering top and side surfaces of the under-bump pattern. a central portion of a bottom surface of the via portion may be provided at a level higher than an edge portion of the bottom surface of the via portion.