APPARATUS FOR TREATING SUBSTRATE

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APPARATUS FOR TREATING SUBSTRATE

This abstract first appeared for US patent application 20250101582 titled 'APPARATUS FOR TREATING SUBSTRATE

Original Abstract Submitted

an apparatus for treating a substrate is provided. an apparatus for treating a substrate comprises a first body, a second body forming a chamber space therein in contact with the first body, a first gas supply line installed in the first body and a first connection portion, and a second gas supply line installed in the second body and a second connection portion, the second connection portion configured to contact the first connection portion, wherein the first connection portion includes a sealing groove, into which a gasket is inserted, on a surface that is in contact with the second connection portion, an inner wall separating a first flow path of the first gas supply line from the sealing groove, and a trench installed on the inner wall and fluidly connecting the first flow path to the sealing groove.