Samsung electronics co., ltd. (20250096215). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
This abstract first appeared for US patent application 20250096215 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Original Abstract Submitted
a semiconductor package includes a redistribution structure, a semiconductor die on the redistribution structure, one or more memory stacking structures disposed on the redistribution structure, wherein the one or more memory stacking structures and the semiconductor die are arranged side by side on the redistribution structure, an optical engine disposed on the redistribution structure, wherein the optical engine and the semiconductor die are arranged side by side on the redistribution structure, and a heat dissipation structure on the semiconductor die, the one or more memory stacking structures, and the optical engine, wherein levels of upper surfaces of the semiconductor die, the one or more memory stacking structures, and the optical engine are the same.
