Samsung electronics co., ltd. (20250096201). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250096201 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
the present disclosure relates to a semiconductor package which includes a wiring structure including insulating layers, wiring layers, and vias, a chip stack structure including a plurality of semiconductor chips and being oblique on the wiring structure such that the plurality of semiconductor chips are inclined with respect to the wiring structure, and a sealing material encapsulating the chip stack structure, wherein each of the plurality of semiconductor chips includes connection pads on one surface of the semiconductor chip, and the plurality of semiconductor chips are being offset with each other such that the connection pads are exposed, and each of the connection pads of each of the plurality of semiconductor chips is in contact with one of the vias and connected to the wiring layers.