SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250096175 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Original Abstract Submitted

a semiconductor package includes a first redistribution layer structure, a first set of semiconductor dies on the first redistribution layer structure, a plurality of connection members on the first redistribution layer structure and around the first set of semiconductor dies, a molding material on the first redistribution layer structure, the molding material covering the first set of semiconductor dies and at least partially surrounding the plurality of connection members, a second redistribution layer structure on the molding material, a second set of semiconductor dies on the second redistribution layer structure, and a dummy structure on the second redistribution layer structure and between a first semiconductor die of the second set of semiconductor dies and a second semiconductor die of the second set of semiconductor dies.