SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250096098 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Original Abstract Submitted

a semiconductor package according to an embodiment includes a first semiconductor structure, including a first substrate, and a semiconductor stacking structure including a plurality of semiconductor dies on the first substrate and including a top surface, a second semiconductor structure on the first semiconductor structure, a second substrate, and a plurality of integrated circuit chips on the second substrate, a plurality of core balls between the first substrate and the second substrate and electrically connecting the first semiconductor structure and the second semiconductor structure, and a molding material for molding the semiconductor stacking structure and the plurality of core balls between the first substrate and the second substrate.