SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 20250093410 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Original Abstract Submitted

provided is a semiconductor device including a first transmission pad configured to output a data signal; a second transmission pad configured to output a clock signal; a data transmission circuit connected to the first transmission pad and comprising a data driver configured to generate the data signal; a clock transmission circuit connected to the second transmission pad and comprising a clock driver configured to generate the clock signal; a core circuit configured to control the data driver and the clock driver; and at least one buffer, wherein each buffer of the at least one buffer comprises: an input terminal connected to at least one of an output terminal of the data driver and an output terminal of the clock driver; and an output terminal connected to the core circuit.