Samsung electronics co., ltd. (20250087570). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
Organization Name
Inventor(s)
HYUNSOO Chung of Suwon-si (KR)
KWANG-SOO Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
This abstract first appeared for US patent application 20250087570 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
Original Abstract Submitted
a semiconductor package includes a redistribution layer structure, a first sub-package positioned on the redistribution layer structure, a second sub-package positioned on the first sub-package, and a first encapsulant positioned on the first sub-package and encapsulating the second sub-package. the first sub-package includes a first semiconductor chip including a first chip through via and a dielectric through via electrically connected to the redistribution layer structure. the second sub-package includes a second semiconductor chip including a plurality of second chip through vias, each second chip through via electrically connected to one of the first chip through via and the dielectric through via, a third semiconductor chip positioned on the second semiconductor chip, and a fourth semiconductor chip positioned on the third semiconductor chip. each of the second to fourth semiconductor chips is exposed at a side surface of the second sub-package and covered with the first encapsulant.
