Samsung electronics co., ltd. (20250087531). SEMICONDUCTOR CHIP STRUCTURE
SEMICONDUCTOR CHIP STRUCTURE
Organization Name
Inventor(s)
Sangjun Park of Yongin-si (KR)
Seungwoo Paek of Yongin-si (KR)
Sungdong Cho of Hwaseong-si (KR)
SEMICONDUCTOR CHIP STRUCTURE
This abstract first appeared for US patent application 20250087531 titled 'SEMICONDUCTOR CHIP STRUCTURE
Original Abstract Submitted
a semiconductor chip structure includes a first semiconductor chip that includes a first chip region and a first scribe lane region and a second semiconductor chip that includes a second chip region and a second scribe lane region respectively bonded to the first chip region and the first scribe lane region. the first semiconductor chip includes a first bonding wiring layer that includes a first bonding insulating layer and a first bonding electrode in the first bonding insulating layer. the second semiconductor chip includes a second bonding wiring layer that includes a second bonding insulating layer and a second bonding electrode in the second bonding insulating layer and a polishing stop pattern. the first bonding insulating layer and the first bonding electrode of the first bonding wiring layer are respectively hybrid bonded to the second bonding insulating layer and the second bonding electrode of the second bonding wiring layer.