Samsung electronics co., ltd. (20250083279). POLISHING PROCESS APPARATUS
POLISHING PROCESS APPARATUS
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POLISHING PROCESS APPARATUS
This abstract first appeared for US patent application 20250083279 titled 'POLISHING PROCESS APPARATUS
Original Abstract Submitted
a polishing process apparatus includes a carrier including a polishing head on which a polishing object is provided, a polishing pad on a lower portion of the carrier, a plurality of temperature sensors on the carrier, and a controller configured to control the carrier, the polishing pad, and the plurality of temperature sensors. the plurality of temperature sensors are in a row in a radial direction, parallel to an upper surface of the polishing head and extending outwardly from a rotation axis of the polishing head. the controller is configured to derive an end point in time of a polishing process using the plurality of temperature sensors and to precisely manage a thickness of the polishing object to be polished, thereby improving reliability of the polishing process apparatus.
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