Samsung electronics co., ltd. (20250081654). SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR CHIPS

Organization Name

samsung electronics co., ltd.

Inventor(s)

IKJUN Choi of Suwon-si (KR)

SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR CHIPS

This abstract first appeared for US patent application 20250081654 titled 'SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR CHIPS

Original Abstract Submitted

a semiconductor package includes a semiconductor chip structure and a transparent substrate. the semiconductor chip structure includes first and second semiconductor chips. the first semiconductor chip includes a semiconductor substrate including first and second surfaces, a wiring layer, and a through electrode. the first semiconductor chip has a step structure on an edge of the semiconductor chip structure and connected to the second surface. the step structure includes first to fourth steps. the first step includes a first bottom surface and a first lateral surface. the second step includes a second bottom surface and a second lateral surface. the third step includes a third bottom surface and a third lateral surface. the through electrode extends from the second bottom surface toward the wiring layer.