Samsung electronics co., ltd. (20250079359). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH
Organization Name
Inventor(s)
Jeong Wan Han of Suwon-si (KR)
Byung Kyu Kim of Suwon-si (KR)
Seok Hwan Jeong of Suwon-si (KR)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH
This abstract first appeared for US patent application 20250079359 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH
Original Abstract Submitted
a semiconductor chip includes a substrate. a device layer and an interconnection layer sequentially on the substrate, and a bonding pad on the interconnection layer. a bottom surface of the bonding pad may be located at a constant level, and a side surface of the bonding pad may have a roughened shape.