Samsung electronics co., ltd. (20250079287). SEMICONDUCTOR PACKAGES
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
JUNGHOON Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGES
This abstract first appeared for US patent application 20250079287 titled 'SEMICONDUCTOR PACKAGES
Original Abstract Submitted
a semiconductor package may include a redistribution substrate that includes a redistribution pattern and a redistribution insulating layer; a semiconductor chip on the redistribution substrate; a connection structure that is spaced apart from the semiconductor chip; and a hybrid via on the connection structure, wherein the hybrid via comprises an inclined portion and an extended portion on the inclined portion, and wherein an angle between the inclined portion and an upper surface of the connection structure ranges from 50� to 75�.