Samsung electronics co., ltd. (20250070012). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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Inventor(s)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250070012 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
the present disclosure relates to semiconductor packages and semiconductor package manufacturing methods. an example semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a support substrate on the first package substrate and spaced apart from a sidewall of the first semiconductor chip, a conductive filler on the support substrate, a connection bump between the support substrate and the interposer and electrically connecting the conductive filler with the interposer, and a first molding layer surrounding the sidewall of the first semiconductor chip and a sidewall of the connection bump.
