Samsung electronics co., ltd. (20250069972). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seungduk Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250069972 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
provided is a semiconductor package including a first semiconductor chip including a first semiconductor substrate having an active surface and an inactive surface opposite to each other, a plurality of second semiconductor chips each including a second semiconductor substrate having an active surface and an inactive surface opposite to each other, and a package molding layer including a bottom molding portion on a portion of an upper surface of the first semiconductor chip, which is exposed by the lowermost second semiconductor chip, and a side molding portion on side walls of the plurality of second semiconductor chips, wherein the side molding portion of the package molding layer extends in a vertical direction from an edge of an upper surface of the bottom molding portion of the package molding layer.