Samsung electronics co., ltd. (20250062257). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Young-Deuk Kim of Suwon-si (KR)
Heejung Hwang of Suwon-si (KR)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
This abstract first appeared for US patent application 20250062257 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Original Abstract Submitted
a semiconductor chip including a body that having a front surface and a rear surface; a wiring structure above the front surface of the body; a through via penetrating the body, and the through via is connected to the wiring structure; a heat dissipation structure above the rear surface of the body, and the heat dissipation structure includes a conductive layer connected to the through via; and a signal pad and a heat dissipation pad on the heat dissipation structure, and the signal pad and the heat dissipation pad are connected to the conductive layer.