Samsung electronics co., ltd. (20250062248). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Yeongkwon Ko of Hwaseong-si (KR)
Un-Byoung Kang of Hwaseong-si (KR)
Teak Hoon Lee of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250062248 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package including a package substrate, a connection substrate on the package substrate and having on a lower corner of the connection substrate a recession that faces a top surface of the package substrate, a semiconductor chip on the connection substrate, a plurality of first connection terminals connecting the connection substrate to the semiconductor chip, and a plurality of second connection terminals connecting the package substrate to the connection substrate. the recession is laterally spaced apart from the second connection terminals.