Samsung electronics co., ltd. (20250062240). SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY
SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY
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SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY
This abstract first appeared for US patent application 20250062240 titled 'SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY
Original Abstract Submitted
an example semiconductor package includes a first redistribution layer, a bridge chip attached to a top surface of the first redistribution layer, a mold layer on the first redistribution layer and enclosing the bridge chip, a second redistribution layer disposed on the mold layer, a conductive post extending through the mold layer vertically and connecting the first redistribution layer and the second redistribution layer, and a first semiconductor chip mounted on the second redistribution layer. the first redistribution layer includes a pad layer and an interconnection layer disposed on the pad layer. the pad layer includes a first insulating layer and pads in the first insulating layer. top surfaces of the pads are exposed to an outside of a top surface of the first insulating layer, and bottom surfaces of the pads are exposed to an outside of a bottom surface of the first insulating layer.