Samsung electronics co., ltd. (20250062238). SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
Organization Name
Inventor(s)
Chang Soo Kim of Suwon-si (KR)
Byung Chul Jeon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
This abstract first appeared for US patent application 20250062238 titled 'SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
Original Abstract Submitted
a semiconductor package is provided. the semiconductor package comprises a package substrate, a first semiconductor chip on the package substrate, a second semiconductor chip spaced apart from the first semiconductor chip on the package substrate, and a bridge die placed below the first semiconductor chip and the second semiconductor chip on the package substrate, wherein the bridge die includes a first face that faces the first semiconductor chip and the second semiconductor chip, a second face that faces the package substrate, a connection wiring structure which is placed on the first face, and connects the first semiconductor chip and the second semiconductor chip, and a power wiring structure which is placed on the second face, and provides power to the first semiconductor chip and the second semiconductor chip.
