Samsung electronics co., ltd. (20250022866). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sanghyeon Jeong of Suwon-si KR
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250022866 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a substrate, a passive element on the substrate, and a connection terminal connecting the substrate to the passive element. the substrate includes a base portion comprising an element pad connected to the connection terminal, and an upper insulating layer on the base portion to expose at least a portion of the base portion. the passive element is in contact with the upper insulating layer, and a thickness of the connection terminal and a thickness of the upper insulating layer are equal to each other.