SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250022844 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Original Abstract Submitted

a semiconductor package according to an embodiment may include, a redistribution layer structure; a first semiconductor stack structure on an upper surface of the redistribution layer structure, wherein the first semiconductor stack structure includes a first chiplet and a second chiplet disposed on the first chiplet; a second semiconductor stack structure on an upper surface of the redistribution layer structure side by side with the first semiconductor stack structure; a bridge die forming an electrical connection between the first semiconductor stack structure and the second semiconductor stack structure, the bridge die being disposed above the first semiconductor stack structure and the second semiconductor stack structure; and a surface mount device (smd) disposed on an upper surface of at least one of the first semiconductor stack structure and the second semiconductor stack structure.