SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250022843 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Original Abstract Submitted

provided a semiconductor package including a redistribution structure, a semiconductor structure on the redistribution structure, a plurality of semiconductor stacking structures on the redistribution structure, the plurality of semiconductor stacking structures being adjacent to the semiconductor structure, and a height of each of the plurality of semiconductor stacking structures being greater than a height of the semiconductor structure, and a heat dissipation structure on the semiconductor structure, the heat dissipation structure including a plurality of through openings, wherein each semiconductor stacking structure among the plurality of semiconductor stacking structures is positioned within a corresponding through opening among the plurality of through openings, and wherein an upper surface of each of the plurality of semiconductor stacking structures is exposed through the corresponding through opening.