SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Organization Name

Inventor(s)

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250022834 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Original Abstract Submitted

an embodiment of the present invention provides a semiconductor package including: a first redistribution layer structure; a semiconductor stack structure on the first redistribution layer structure, the semiconductor stack structure including a first semiconductor die and a second semiconductor die on the first semiconductor die; a plurality of wires configured to electrically connect the second semiconductor die to the first redistribution layer structure; a substrate on the first redistribution layer structure and around the semiconductor stack structure; a molding material configured to mold the semiconductor stack structure and the wires on the first redistribution layer structure; and forming a second redistribution layer structure on the molding material.