Samsung electronics co., ltd. (20250022787). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250022787 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
disclosed is a semiconductor package comprising a first semiconductor chip, a second semiconductor chip, and a connection die. a hybrid bonding may be established between the connection die and the first semiconductor chip and between the connection die and the second semiconductor chip. the first semiconductor chip includes a first semiconductor substrate having first and second surfaces. the first surface is closer than the second surface to the connection die. the second semiconductor chip includes a second semiconductor substrate having third and fourth surfaces. the third surface is closer than the fourth surface to the connection die. the first and second semiconductor chips further include a power distribution wiring layer on the second surface of the first semiconductor chip and the fourth surface of the second semiconductor substrate.