Samsung electronics co., ltd. (20250022785). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
This abstract first appeared for US patent application 20250022785 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Original Abstract Submitted
a semiconductor chip includes a semiconductor substrate, an insulation layer positioned on the semiconductor substrate and that includes a plurality of via holes, and a bump positioned within the plurality of via holes and on the insulation layer. portions of the bump positioned within the plurality of via holes are connected to each other.