Samsung electronics co., ltd. (20250022758). SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
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SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 20250022758 titled 'SEMICONDUCTOR DEVICE
Original Abstract Submitted
a semiconductor device includes a semiconductor substrate, a connection pad disposed on an interlayer insulating layer and electrically connected to an interconnection structure, a passivation layer disposed on the connection pad and having a first opening and a second opening, each exposing at least a portion of the connection pad, a first bump that includes a first lower conductive layer in contact with the connection pad within the first opening and a first upper conductive layer on the first lower conductive layer, and a second bump that includes a second lower conductive layer in contact with the connection pad within the second opening and a second upper conductive layer on the second lower conductive layer. the first and second lower conductive layers include the same material, and the first upper conductive layer and the second upper conductive layer include different materials.