Samsung electronics co., ltd. (20250015048). SEMICONDUCTOR PACKAGES
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
SANG CHEON Park of Suwon-si KR
SEMICONDUCTOR PACKAGES
This abstract first appeared for US patent application 20250015048 titled 'SEMICONDUCTOR PACKAGES
Original Abstract Submitted
a semiconductor stack structure includes: a plurality of semiconductor dies vertically stacked on each other; and one or more dummy dies positioned between the plurality of semiconductor dies, wherein each of the one or more dummy dies includes: a dummy die base; a first interconnection structure positioned on a first side of the dummy die base and including a plurality of first bonding pads, wherein the first bonding pads are positioned at substantially regular intervals; and a second interconnection structure positioned on a second side of the dummy die base and including a plurality of second bonding pads, wherein the second bonding pads are positioned at substantially regular intervals.