Samsung electronics co., ltd. (20250015005). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250015005 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes: a plurality of transmission external terminals; a plurality of reception external terminals; a semiconductor chip including a plurality of transmission pads, a plurality of reception pads, and at least one option pad; a plurality of transmission lanes electrically connected between the plurality of transmission external terminals and the plurality of transmission pads; and a plurality of reception lanes electrically connected between the plurality of reception external terminals and the plurality of reception pads. the semiconductor chip is configured to swap signals or connections for the plurality of transmission pads, or swap signals or connections for the plurality of reception pads, selectively depending on an input of the at least one option pad.